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  page 1 hpr7xxc rev. b (mps) 12/2008 5 w att u nregulated sip dc/dc c onverter hpr7xxc description the hpr7xxc series provides high power densities where space is critical. the small sip package measures only 2.2" x .3" x .4" (56 x 9 x 10 mm). designed for high density boards, the package is non-conductive, which presents advantages over painted metal enclosures. the series includes many different voltage models (other input and output voltages are available upon request), all set in a low thermal resistance molding compound, called iso-thermoflex ? , which provides excellent heat dissipation of internal components. the use of surface mount devices and manufacturing processes, combined with the encapsulation process, assure the user that the product is more environmentally rugged than any other dc/dc converter of its type. operation down to no load will not impact the reliability of the series, although this product has a 10ma minimum load for speci?cation purposes. it is recommended that all pins be used for current carrying capacity even though duplicate pin-outs are internally connected. the hpr7xxc has 500vdc isolation barrier between input and output, offering the designer maximum ?exibility in grounding options and polarity con?gurations. the outstanding mttf, superior reliability, and low cost make it an excellent choice for any high power-density applications. features l rohs compliant l efficiency >80% l sip package l high power density: >16 watts/inch 3 l low cost l single and dual outputs l internal input and output filtering l six-sided shielding mechanical 15. com 19. com 20. -vout 15. +vout 19. -vout 20. -vout 7. -vin 9. -vin 14. +vout 1. +vin 2. +vin 6. -vin all dimensions are in inches (millimeters) grid: 0.100 inches (2.54 millimeters) pin placement tolerance: 0.015" 1. +vin 2. +vin 6. -vin 7. -vin 9. -vin 14. +vout pin connections: duals pin connections: singles top view front view bottom view right side view 2.210 + 0-.10 (56.13) 0.020 + .002 (0.51) 0.155 + -.15 (3.94) 0.030 + -.010 (0.76) 0.340 + .010 (8.64) 0.050 + .015 (1.27) 0.010 + .002 (0.25) 0.140 + .020 (3.56) 0.400 + .010 (10.16) 0.140 + .020 (3.56) c l 1 2 6 7 9 14 15 19 20 obsolete product contact factory for replacement model
page 2 hpr7xxc rev. b (mps) 12/2008 nominal rated rated input current reflected input output output no load rated load ripple efficiency voltage voltage current current model (vdc) (vdc) (ma) (ma) (ma) (map-p) (%) hpr700c 5 5 1000 70 1250 15 80 hpr703c 5 5 500 70 1250 15 80 hpr704c 5 12 208 70 1190 15 84 hpr705c 5 15 167 70 1190 15 84 HPR706C 12 5 1000 25 490 15 80 hpr710c 12 12 208 25 490 15 85 hpr711c 12 15 167 25 490 15 85 hpr712c 15 5 1000 20 407 15 82 hpr717c 15 15 167 20 392 15 85 note: other input to output voltage options may be available. please consult factory. electrical characteristics speci?cations typical at t a = +25c, nominal input voltage, rated output current unless otherwise speci?ed. ordering information hpr 7xx c device family hpr indicates dc/dc converter model number rohs compliant common specifications speci?cations typical at t a = +25c, nominal input voltage, rated output current unless otherwise speci?ed. parameter conditions min typ max units input voltage range 4.75 5 5.25 v dc 11.4 12 12.6 v dc 14.2 15 15.8 v dc voltage rise time see application note: "capacitive loading effects on start-up of dc/dc converters" isolation rated voltage 500 v dc test voltage 60 hz, 10 seconds 500 vpk resistance 1 g w capacitance 55 pf leakage current v iso = 240vac, 60hz 5 arms output rated power 5 w voltage setpoint accuracy rated load, nominal v in 3 % temperature coef?cent 0.05 %/deg c ripple & noise bw = dc to 10mhz 50 mvp-p bw =10hz to 2mhz 5 mvrms voltage i l =10ma, v out = 5v 5.75 v dc i l =10ma, v out = 12v 13.10 v dc i l =10ma, v out = 15v 16.25 v dc regulation line regulation high line to low line 1.2 %/%vin load regulation (5v out only) rated load to no load 15 % load regulation (all other models) rated load to no load 10 % general switching frequency 170 khz package weight 7 g mttf per mil-hdbk-217, rev. e circuit stress method ground benign t a = +25c 2000 khr temperature speci?cation -25 +25 +70 c operation -40 +85 c storage -40 +110 c absolute maximum ratings internal power dissipation.......................................................................1.7w short circuit protection..................................................................momentary lead temperature (soldering, 10 seconds max)................................+300c
page 3 hpr7xxc rev. b (mps) 12/2008 the information provided herein is believed to be reliable; however, murata power solutions assumes no responsibility for inacc uracies or omissions. murata power solutions assumes no responsibility for the use of this information, and all use of such information shall be entirely at the users own risk. pr ices and speci?cations are subject to change without notice. no patent rights or licenses to any of the circuits described herein are implied or granted to any third party. murata power solutions does not authorize or warrant any murata power solutions product for use in life support devices/systems or in aircraft control applications. typical performance curves speci?cations typical at t a = +25c, rated input voltage, rated output current unless otherwise speci?ed. 5.6 5.4 5.2 5.0 4.8 10 250 500 750 1000 5.6 5.4 5.2 5.0 4.8 10 250 500 750 1000 12.6 12.4 12.2 12.0 11.8 10 250 500 750 1000 15.6 15.4 15.2 15.0 14.8 10 250 500 750 1000 output current (ma) output current (ma) output current (ma) output current (ma) v out vs load (5v out models) v out vs load (+5v out models) v out vs load (+15v out models) v out vs load (+12v out models) vout vout vout vout these devices are intended for wave soldering or manual soldering. they are not intended to be subject to surface mount processes under any circumstances. the normal wave soldering process can be used with these devices where the device is subjected to a maximum wave temperature of 260c for a period of no more than 10 seconds. within this time and temperature range, the integrity of the devices plastic body will not be compromised and internal temperatures within the converter will not exceed 175c. care should be taken to control m anual soldering limits identical to that of wave soldering. through-hole soldering information murata power solutions, inc. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe upon existing or future patent rights. the descriptions contained her ein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith. speci?cations are subject to chan ge without notice. ? 2008 murata power solutions, inc. usa: mans?eld (ma), tel: (508) 339 3000, email: sales@murata-ps.com canada: toronto, tel: (866) 740 1232, email: toronto@murata-ps.com uk: milton keynes, tel: +44 (0)1908 615232, email: mk@murata-ps.com france: montigny le bretonneux, tel: +33 (0)1 34 60 01 01, email: france@murata-ps.com germany: mnchen, tel: +49 (0)89-544334-0, email: ped.munich@murata-ps.com japan: tokyo, tel: 3-3779-1031, email: sales_tokyo@murata-ps.com osaka, tel: 6-6354-2025, email: sales_osaka@murata-ps.com china: shanghai, tel: +86 215 027 3678, email: shanghai@murata-ps.com guangzhou, tel: +86 208 221 8066, email: guangzhou@murata-ps.com singapore: parkway centre, tel: +65 6348 9096, email: singapore@murata-ps.com murata power solutions, inc. 11 cabot boulevard, mans?eld, ma 02048-1151 u.s.a. tel: (508) 339-3000 (800) 233-2765 fax: (508) 339-6356 www.murata-ps.com email: sales@murata-ps.com iso 9001 & iso 14001 registered


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